[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Welding failure analysis of tungsten-copper composite material used for microwave circuits
Ye Jianhai,, Bao Shengxiang,, Ma Lili,, Shi Guanghua,, Li Peng,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582762
File:
PDF, 1.92 MB
english, 2010