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[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - The flip-chip bump interconnection for millimeter-wave GaAs MMIC
Kusamitsu, H., Morishita, Y., Maruhashi, K., Ito, M., Ohata, K.Year:
1998
Language:
english
DOI:
10.1109/icmcm.1998.670753
File:
PDF, 513 KB
english, 1998