[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Dynamic phase-frequency characteristic of thermosonic wire bonder transducer
Wang, Fuliang, Zou, Changhui, Qiao, JiapingYear:
2008
Language:
english
DOI:
10.1109/icept.2008.4607106
File:
PDF, 372 KB
english, 2008