IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1997 / Aug. Vol. 20; Iss. 3
VCSEL electrical packaging analysis and design guidelines for multi-GHz applications
Hall, S.H., Walters, W.L., Mattson, L.F., Fokken, G.J., Gilbert, B.K.Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.618216
Date:
January, 1997
File:
PDF, 277 KB
english, 1997