Pressure-Free Phenomenon in Top Layer of Chip Body Under...

IEEE Electron Device Letters 2014 / 8 Vol. 35; Iss. 8

Pressure-Free Phenomenon in Top Layer of Chip Body Under Local Pressure and Design of Channel-Free Flat-Packaged IGBT

Teng, Yuan, Zhu, Yangjun, Yu, Qiaoqun, Zhang, Wenliang
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Volume:
35
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2014.2328571
Date:
August, 2014
File:
PDF, 666 KB
english, 2014
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