Study of electromigration-induced Cu consumption in the...

Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps

Liu, C. Y., Ke, Lin, Chuang, Y. C., Wang, S. J.
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Volume:
100
Year:
2006
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.2357860
File:
PDF, 809 KB
english, 2006
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