Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps
Liu, C. Y., Ke, Lin, Chuang, Y. C., Wang, S. J.Volume:
100
Year:
2006
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.2357860
File:
PDF, 809 KB
english, 2006