[IEEE 2014 IEEE International Interconnect Technology...

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[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability

Nogami, T., Chae, M., Penny, C., Shaw, T., Shobha, H., Li, J., Cohen, S., Hu, C-K., Zhang, X., He, M., Tanwar, K., Patlolla, R., Chen, S-T., Kelly, J., Lin, X., Straten, O., Simon, A., Motoyama, K., B
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Year:
2014
Language:
english
DOI:
10.1109/iitc.2014.6831875
File:
PDF, 672 KB
english, 2014
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