[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
Gu, Xiaoxiong, Rimolo-Donadio, Renato, Budd, Russell, Baks, Christian W., Turlapati, Lavanya, Jahnes, Christopher, Kuchta, Daniel M., Schow, Clint L., Libsch, FrankYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575672
File:
PDF, 1.16 MB
english, 2013