[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Competitiveness and Technical Challenges of Low Cost Wirebond Packaging for High Speed SerDes Applications in ASICs
Zwitter, Deborah, Na, Nanju, Arseneault, Marcel, Yonehara, Katsuyuki, Hu, Haitian, Bailey, Mark, Cannon, ToddYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373886
File:
PDF, 4.50 MB
english, 2007