![](/img/cover-not-exists.png)
[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System
Ahmad, I., Jiun, Hoh Huey, Leng, Eu Poh, Majlis, B.Y., Jalar, A., Wagiran, R.Year:
2006
Language:
english
DOI:
10.1109/smelec.2006.380690
File:
PDF, 1.48 MB
english, 2006