Massive spalling of Cu-Zn and Cu-Al intermetallic compounds...

Journal of Applied Physics 2012 Vol. 111; Iss. 7

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Kotadia, H. R., Panneerselvam, A., Mokhtari, O., Green, M. A., Mannan, S. H.
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Volume:
111
Year:
2012
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.3699359
File:
PDF, 1.78 MB
english, 2012
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