[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Engineered thermal interface material
Larson, Lyndon, Tang, Yin, Durfee, Loren, Hale, Cassandra, Plante, David, Iruvanti, Sushumna, Wagner, Rebecca, Davis, Taryn, Longworth, Hai, Lavoie, Annique, Langois, RichardYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897294
File:
PDF, 2.73 MB
english, 2014