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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages
Kung, Huang-Kuang, Huang, Bo-Wun, Hsu, Hsiang-ChenYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699626
File:
PDF, 131 KB
english, 2010