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[IEEE 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Enschede, The Netherlands (8-11 October 1996)] Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - A new method to determine the influence of thermomechanical stress on the reliability of metal lines in integrated circuits
Glasow, A.v., Kammer, H., Kohlhase, A.Year:
1996
Language:
english
DOI:
10.1109/esref.1996.888209
File:
PDF, 228 KB
english, 1996