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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Thermal management in high performance computers by use of heat Pipes and vapor chambers, and the challenges of global warming and environment
Masataka Mochizuki,, Nguyen, Thang, Koichi Mashiko,, Yuji Saito,, Xiao Ping Wu,, Nguyen, Tien, Vijit Wuttijumnong,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382144
File:
PDF, 2.55 MB
english, 2009