[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - New dicing and thinning concept improves mechanical reliability of ultra thin silicon
Landesberger, C., Klink, G., Schwinn, G., Aschenbrenner, R.Year:
2001
Language:
english
DOI:
10.1109/isaom.2001.916555
File:
PDF, 835 KB
english, 2001