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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications
Lo, Jeffery C. C., Lee, S. W. Ricky, Wu, Henry H. L., Lam, Jimmy K. S.Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550239
File:
PDF, 1.60 MB
english, 2008