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[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Wang, Teng, Jonsson, Martin, Campbell, Eleanor, Liu, JohanYear:
2006
Language:
english
DOI:
10.1109/estc.2006.280117
File:
PDF, 4.13 MB
english, 2006