[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Novel conductive paste using Hybrid Silver Sintering Technology for high reliability power semiconductor packaging
Jin, Howard Hwail, Kanagavel, Senthil, Chin, Wai FooYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897541
File:
PDF, 3.77 MB
english, 2014