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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - A dynamic study of pad structure impact on bond pad/low-K layer stress in copper wire bond
Yang, Y. B., Kumar, N., John, D., Hyman, R., Clive, F., Nathapong, S., Ramroth, W.Year:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507163
File:
PDF, 1.12 MB
english, 2012