[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - High-Density Compliant Die-Package Interconnects
Muthukumar, S., Hill, C.D., Ford, S., Worwag, W., Dambrauskas, T., Challela, P.C., Dory, T.S., Patel, N.M., Ramsay, E.L., Chau, D.S.Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645810
File:
PDF, 919 KB
english, 2006