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[IEEE 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Yokohama, Japan (2014.9.9-2014.9.11)] 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Increasing mobility and spin lifetime with shear strain in thin silicon films
Osintsev, Dmitri, Sverdlov, Viktor, Windbacher, Thomas, Selberherr, SiegfriedYear:
2014
Language:
english
DOI:
10.1109/sispad.2014.6931596
File:
PDF, 1.50 MB
english, 2014