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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - A manufacturing approach to reducing underfill voiding on large die (> 18 mm) flip chip organic laminate packaging
de Sousa, Isabel, Belanger, Luc, Dufort, Catherine, Chenier, Simon DlYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898635
File:
PDF, 1.16 MB
english, 2011