Synthesis of polyimides containing pyridine or triazole moiety to improve their adhesion to sputter-deposited copper
Ku, Chun-Kang, Ho, Chang-Hong, Lee, Yu-DerVolume:
19
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/1568561054951004
Date:
January, 2005
File:
PDF, 252 KB
english, 2005