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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Rate dependence of bending fatigue failure characteristics of lead-free solder joint
Bang, Woong Ho, Chen, Liang-Shan, Kim, Choong-Un, Lee, Tae-Kyu, Liu, Kuo-ChuanYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074309
File:
PDF, 1.03 MB
english, 2009