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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effect of wafer back grinding on the mechanical behavior of multilayered low-k for 3D-stack packaging applications
Sekhar, V. N., Lu Shen,, Kumar, Aditya, Chai, T. C., Lee, Wen Sheng Vincent, Wang Xin Lin Sandy,, Xiaowu Zhang,, Premchandran, C. S., Kripesh, V., Lau, John H.Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550177
File:
PDF, 1.59 MB
english, 2008