[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Advances in thermoelectric microcooling
Leilei Han,, Chunqing Wang,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582813
File:
PDF, 458 KB
english, 2010