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Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging
Ouyang, Fan-Yi, Hsu, Hao, Su, Yu-Ping, Chang, Tao-ChihVolume:
112
Year:
2012
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4737154
File:
PDF, 3.13 MB
english, 2012