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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy
Yiqing Wang,, Dongyan Ding,, Ting Liu,, Galuschki, Klaus-Peter, Yu Hu,, Gong, Angela, Ming Shen,, Hongqi Sun,, Xianfeng Wang,, Jiangyan Sun,, Ming Li,, Dali Mao,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582636
File:
PDF, 2.11 MB
english, 2010