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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Effect of Finite Element Modeling Techniques on Solder Joint Fatigue Life Prediction of Flip-Chip BGA Packages
Xuejun Fan,, Min Pei,, Bhatti, P.K.Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645772
File:
PDF, 637 KB
english, 2006