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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction
Yin, Wen, Yu, Daquan, Dai, Fengwei, Song, Chongshen, Bo, Zhang, Wan, Lixi, Yu, Han, Sun, JiangyanYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249068
File:
PDF, 1.10 MB
english, 2012