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Profile simulation of conformality of chemical vapor deposited copper in subquarter-micron trench and via structures
A. Burke, G. Braeckelmann, D. Manger, E. Eisenbraun, A. E. Kaloyeros, J. P. Mcvittie, J. Han, D. Bang, J. F. Loan, J. J. SullivanYear:
1997
Language:
english
DOI:
10.1063/1.366204
File:
PDF, 2.48 MB
english, 1997