[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Simulation Methodologies for Electromagnetic Compatibility (EMC) and Signal Integrity (SI) for System Design
Christopoulos, C., Thomas, D.W.P., Sewell, P., Paul, J., Biwojno, K., Wykes, J., Tang, Q., Greedy, S.Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614438
File:
PDF, 3.67 MB
english, 2005