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[IEEE TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference - Lyon, France (2007.06.10-2007.06.14)] TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference - Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration
Phommahaxay, Alain, Lissorgues, Gaelle, Rousseau, Lionel, Perrais, Vincent, Marty, Frederic, Bourouina, Tarik, Nicole, PierreYear:
2007
Language:
english
DOI:
10.1109/sensor.2007.4300570
File:
PDF, 659 KB
english, 2007