[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Investigation of heat transfer enhancement of vertical heat sinks by piezoelectric fan
Shyu, Jin-Cherng, Syu, Jhih-ZongYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117271
File:
PDF, 592 KB
english, 2011