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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Comparison of new die-attachment technologies for power electronic assemblies
Moller, Eike, Bajwa, Adeel Ahmad, Rastjagaev, Eugen, Wilde, JurgenYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897527
File:
PDF, 2.79 MB
english, 2014