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Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density
Y. H. Zhao, J. F. Bingert, Y. T. Zhu, X. Z. Liao, R. Z. Valiev, Z. Horita, T. G. Langdon, Y. Z. Zhou, E. J. LaverniaYear:
2008
Language:
english
DOI:
10.1063/1.2870014
File:
PDF, 591 KB
english, 2008