Tougher ultrafine grain Cu via high-angle grain boundaries...

  • Main
  • Tougher ultrafine grain Cu via...

Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

Y. H. Zhao, J. F. Bingert, Y. T. Zhu, X. Z. Liao, R. Z. Valiev, Z. Horita, T. G. Langdon, Y. Z. Zhou, E. J. Lavernia
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1063/1.2870014
File:
PDF, 591 KB
english, 2008
Conversion to is in progress
Conversion to is failed