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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Cu wire bonding in Ni/Pd/Au-Ag and roughened Ni/Pd/Au-Ag pre-plated leadframe packages
Wu-Hu Li,, Acuesta, Albert, Mercado, Mary Grace, Malonzo, Nicolas Torres, Cabral, Raymond SolisYear:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184536
File:
PDF, 1.95 MB
english, 2011