Implementation of carbon nanotube bundles in sub-5 micron...

Materials Today Communications 2015 / 03 Vol. 2

Implementation of carbon nanotube bundles in sub-5 micron diameter through-silicon-via structures for three-dimensionally stacked integrated circuits

Ghosh, Kaushik, Verma, Yashwant K., Tan, Chuan Seng
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Volume:
2
Language:
english
Journal:
Materials Today Communications
DOI:
10.1016/j.mtcomm.2014.11.004
Date:
March, 2015
File:
PDF, 3.85 MB
english, 2015
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