[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - An analysis of the effect of wire resistance on circuit level performance at the 45-nm technology node

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.