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[IEEE 1997 International Conference on Multichip Modules - Denver, CO, USA (2-4 April 1997)] Proceedings 1997 International Conference on Multichip Modules - Uniform copper electroplating for application to multichip modules
Glezen, J.H., Naseem, H.A., Ulrich, R.K., Schaper, L.W., Brown, W.D.Year:
1997
Language:
english
DOI:
10.1109/icmcm.1997.581178
File:
PDF, 445 KB
english, 1997