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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Design guidelines to implement Six Sigma in assembly process yield of area array solder interconnect packages
Chunho Kim,, Baldwin, D.F.Year:
2002
Language:
english
DOI:
10.1109/ectc.2002.1008315
File:
PDF, 896 KB
english, 2002