[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Study on fatigue strength characteristics for solder joints
Daisuke Kaneko,, Hirotsugu Inoue,, Kikuo Kishimoto,, Masaki Omiya,, Masazumi Amagai,Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510302
File:
PDF, 6.02 MB
english, 2007