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[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Study of re-sputtering effect on metallization for Cu interconnect
Zhang, Jiwei, Cheng, Xiu-lan, Wu, Ting-bin, Ni, Bai-bing, Jiang, Ronnie, Liu, En-feng, Hua Zhou, Qi-yuYear:
2006
Language:
english
DOI:
10.1109/icsict.2006.306221
File:
PDF, 100 KB
english, 2006