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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Failure analyse of the welding point in flip-chip BGA packages in the drop-free
Yuan, Guozheng, Bai, Chuang, Shu, XuefengYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474800
File:
PDF, 700 KB
english, 2012