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[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Fatigue life estimation of a stretched-solder-column ultra-fine-pitch wafer level package using the macro-micro modelling approach
Chng, A.C., Tay, A.A.O., Lim, K.M., Wong, E.H.Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1320327
File:
PDF, 436 KB
english, 2004