[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Correlation between Cu microstructure and TSV Cu pumping
De Messemaeker, Joke, Pedreira, Olalla Varela, Philipsen, Harold, Beyne, Eric, De Wolf, Ingrid, Van der Donck, Tom, Croes, KristofYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897349
File:
PDF, 2.92 MB
english, 2014