Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists
K. Takeda, Y. Miyawaki, S. Takashima, M. Fukasawa, K. Oshima, K. Nagahata, T. Tatsumi, M. HoriYear:
2011
Language:
english
DOI:
10.1063/1.3544304
File:
PDF, 458 KB
english, 2011