Effect of Aluminum Content on Mechanical Properties and Thermal Conductivities of Sintered Reaction-Bonded Silicon Nitride
Kusano, Dai, Hyuga, Hideki, Zhou, You, Hirao, KiyoshiVolume:
11
Language:
english
Journal:
International Journal of Applied Ceramic Technology
DOI:
10.1111/ijac.12035
Date:
May, 2014
File:
PDF, 410 KB
english, 2014