[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Flexural testing of board mounted wafer level packages for handheld devices
Patwardhan, V., Chin, D., Wong, S., Rey, E., Kelkar, N., Nguyen, L.Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441322
File:
PDF, 480 KB
english, 2005